PacTech Asia Sdn Bhd

Job Description:

Basic troubleshooting, installation, process evaluation and setup, maintenance and repair on designated equipment.
Completing Preventive Maintenance and field modifications.
Ordering and managing repair parts cycle times.
Keeping up to date on administrative responsibilities such as maintaining customer service log and internal service records in a timely manner.
Maintaining daily communications with customers to ensure resolution and proper follow-up.
Maintaining tools and test equipment and ensuring they are properly calibrated.
Meeting Health and Human Services, Environmental Health and Safety and/or all other applicable regulatory requirements.
Utilizing the escalation process to resolve customer service delivery issues.
Working as a member of the local team to provide efficient service delivery to all accounts within assigned area globally & support headquarters when necessary.
The ability to lift and carry a toolbox that can weigh up to 5lbs.
Adhering to current regulatory requirements to include, but not limited to HIPPA, OSHA, FDA and etc.
Any ad hoc tasks assigned by your superior.

Job Requirement:

Candidate must possess at least Bachelor Degree in an Engineering or Science Discipline with at least 3 years of working experience as a process, field service or application engineering in semiconductor industry.
Have some experiences in technologies like thin film deposition, SMT, Cu-RDL or Cu-Pillar, or WLP in general.
Familiar with concepts and documents like FMEA, Control Plan, SPC, Work Instruction etc.
Good presentation, communication and team working skills.
Having “Hands on” attitude and creative problem-solving mind set to get the work done quickly and effectively to meet customers schedules.
Applicants should have full working rights for Malaysia.
Possess own transport.
Willing to travel in short notice.
Chinese speaking and writing will be advantage.